| |
Design
Guidelines |
Gold
Bumps |
| 1 |
Bump
Height Average |
18
µm & 25 µm std. |
| 2 |
Bump
Height Co Planarity |
+/-
1 µm (in die), +/- 2 µm (in water),
+/- 3 µm (wf to wf) |
| 3 |
Bump
Pitch |
50
µm Typical |
| 4 |
Bump
Spacing |
16
µm Minimum |
| 5 |
Bump
to Pass. Overlap |
7
µm Per Side Minimum |
| 6 |
Bond
Pad to Pass. Opening |
14
µm Per Side Minimum |
| 7 |
Passivation
Type |
Nitride,
OxyNitride, Polyimide |
| 8 |
Incoming
Wafer Edge Exclusion |
5
mm (from wafer edge) for 6" and 8" wafer |
| 9 |
Bump
Material |
99.9%
pure Gold |
| 10 |
UBM
Material |
TiW
+ Au |
| 11 |
Shear
Testing Height |
7
µm above wafer surface |
| 12 |
Shear
Strength |
>
8.5 mgf/µm² |
| 13 |
Bump
Hardness |
HV
23~61 after annealing |
| 14 |
Bump
Mask Design and Layout |
APS
In-house Design Capability;
Require GDSII, Stepping Distance, Wafer Map |
