Unitive Sign License With APS For Their Patented Copper Pillar Bump

30 April 2003

Advanpack Solution Pte. Ltd (“APS”) has licensed to Unitive Inc to manufacture the APS’s patented Copper Pillar Bump for advanced semiconductor packaging. Ken Donahue, Unitive CEO, pointed out that “From the beginning, our goal has been to push the envelope in bumping technologies, and this is another very big step in that direction”.

Unitive is a leading provider of wafer-level packaging solutions that make semiconductors smaller, faster and lighter. This partnership will provide APS’s OEM customers with a world-class high-volume manufacturing partner. APS is a start up in Singapore funded by EDB Investments and PLE Investments, in partnership with Advanced System Automation of Singapore, H&Q and others.

The APS technology uses a non-reflowable copper bump to support a reflowable solder tip. The copper pillar enables fine pitch bumping and increases the standoff. This allows robust high-volume assembly with reliability superior to conventional solder bump technologies. APS has filed patents on many leading edge technologies, including unique pillar bumps, No Flow Underfill materials, assembly processes and several types of packaging, including Wafer Level CSP. With a full-service wafer-bumping fab in Singapore, APS also provides flip-chip assembly services.