ADVANCED SYSTEMS AUTOMATION 'S ASSOCIATED COMPANY, ADVANPACK SOLUTIONS, ENTERS INTO JOINT VENTURE AGREEMENT WITH MALAYSIAN-LISTED UNISEM (M) BHD ON FLIP CHIP TECHNOLOGY PRODUCTION AND PACKAGING

-         Joint venture company will be involved in wafer bumping and packaging of semiconductors devices based on APS’ proprietary technologies

-         Latest joint venture is an industry and technology first for Malaysia

Singapore, 23 September 2004 – Advanpack Solutions Pte Ltd (“APS”), a wholly-owned subsidiary of APS Investment Pte Ltd which is an associated company of Singapore SESDAQ listed Advanced Systems Automation Limited (“ASA”), has entered into a joint venture agreement with Malaysia-listed Unisem (M) Bhd, to establish a joint venture company. The JV company, Unisem-Advanpack Technologies Sdn. Bhd (“UAT”), will be involved in wafer bumping and packaging of semiconductor devices based on APS’ proprietary technologies.

According to the agreement, Unisem will contribute 65% of the initial investment in cash whilst APS will contribute license, technology transfer fee and royalties towards a 35% stake towards the joint venture.  UAT will have an authorised capital of US$26.3 million and an initial investment of US$15 million.

UAT also will have the right to use APS’ wafer bumping and packaging technologies as well as the right to manufacture and sell the products.

Mr John Chia, Chairman of Unisem, said:  “Through the Agreements, the Unisem Group will be able to acquire the industry leading technology for wafer bumping and wafer level chip scale packaging technologies. APS’ technologies in wafer bumping and advanced packaging capabilities will allow Unisem to position itself in the high growth markets for flip chip and wafer level packaging”.

Mr. Jimmy Chew Hwee Seng, APS’ CEO added:  “The combination of our strengths, with Advanpack Solutions’ proprietary technology coupled with Unisem’s high volume, low-cost manufacturing capabilities, bodes well for UAT’s future within the semiconductor industry”.

About Unisem (M) Bhd. (www.unisem.com.my)

Unisem was incorporated in 1989 and commenced operations in 1992 as an independent IC packaging and test house. Unisem provides full turnkey solutions to its customers in wafer probing, packaging and testing of ICs, tape and reel, and dropship services. Since its commencement, Unisem has invested approximately RM890 million in land, buildings, plant and machinery in its main production facilities in Ipoh, Malaysia. The factories have a total built-up of approximately 570,000 square feet and are erected on a 15-acre site. Unisem has current staff strength of approximately 3,600.

About Advanpack Solutions Pte. Ltd. (www.advanpack.com)

APS is an associated company of Advanced System Automation Ltd (“ASA”), a listed company on the SGX-SESDAQ. APS develops proprietary technology and provides innovative and integrated flip chip solutions to companies that manufacture semiconductors.

Media Contact:
Unisem (M) Bhd.
Ruth Chin
Email: ruthchin@unisem.com.my

Advanpack Solutions Pte. Ltd.
Ch’ng Han Shen
Email: hschng@advanpack.com