| |
Design
Guidelines |
Solder
Bumps (Eutectic or High Lead) |
| 1 |
Bump
Shape |
100
µm |
| 2 |
Standard
Bump Height |
150
µm Minimum |
| 3 |
Bump
Height Co Planarity |
+/-
5 µm (in die), +/- 10µm (in water),
+/- 15µm (wf to wf) |
| 4 |
Bump
Pitch |
150
µm Minimum |
| 5 |
Bump
Spacing |
75
µm Minimum |
| 6 |
Bump
to Pass. Overlap |
7
µm Per Side Minimum |
| 7 |
Bond
Pad to Pass. Opening |
14
µm Per Side Minimum |
| 8 |
Passivation
Type |
Nitride,
OxyNitride, Polyimide |
| 9 |
Incoming
Wafer Edge Exclusion Zone |
5
mm (from wafer edge) for 6" and 8" wafer |
| 10 |
Bump
Material |
63Sn/37Pb
+/- 5%, 5Sn/95Pb +/- 3% |
| 11 |
UBM
Material |
Ti
+ Cu |
| 12 |
Shear
Testing Height |
30
µm above wafer surface |
| 13 |
Shear
Strength |
>3.0
mgf/µm² for 63/37eutectic solder bump
>1.5 mgf/µm² for 5/95 high lead solder
bump |
| 14 |
Bump
Mask Design and Layout |
APS
In-house Design Capability;
Require GDSII, Stepping Distance, Wafer Map |
