|
|
| |
Wafer Bumping
Pad
Redistribution (RDL)
RDL
Process
RDL
Guidelines
| Design
Guidelines |
| Bump
Shape |
Octagonal |
| Pillar
Structure |
Copper
post + solder cap |
| Bump
Height : |
Copper
post |
| |
Solder
cap |
|
|
| Bond
Pad to Pass. Opening |
14
µm Per Side (Min) |
| RDL
trace metal |
Cu |
| RDL
trace thickness |
3
µm |
| RDL
trace width (min) |
15
µm |
| RDL
trace spacing (min) |
15
µm |
|
|
|
