| |
Materials
No-N2
No-Clean Flux (P-Coat)
APS P-Coat F0284 is a polymer flux which has the following advantages:
| 1.
|
Does
not require N2 during reflow - Cost reduction! |
| 2. |
Does
not require cleaning after reflow - Process step
reduction! |
| 3.
|
Increases
shear strength by 20% - Better reliability and
impact resistance! |
| 4.
|
Available
for flip chip & BGA applications |
| 5. |
Utilizes
existing infrastructure |
| 6. |
Halide-free
|
| 7. |
Lead-free
compatible |
Concept of P-Coat:
 P-Coat’s
unique composition, when activated during reflow, forms
a protective film that prevents reoxidation while its
fluxing properties removes even the toughest metal oxides.
Upon completion of reflow, the thermosetting resin and
hardener cross-links resulting in the inactivation of
the fluxing reactive groups and subsequent curing of
P-Coat. This forms a protective fillet which increases
the shear strength and thus the reliability of the joints. |
|
 Flip
Chip Application:
P-Coat can be used for flip chip attachments as seen
on the right. The protective fillet around the bumps,
highlighted by the arrows, increases the joint integrity.
The
cross-section picture shows good solder wetting and
joint formation.
|
 BGA
Application:
P-Coat can be also used for BGA ball attachments as
seen on the left. The protective fillet of the BGA ball,
highlighted by the arrows, increases the joint integrity.
|
Contact
us for more information now! |
