|
|
|
|
 |
 |
| |
Materials
No
Flow Underfill (P-Bond)
APS
has developed a No-flow Underfill material, called P-Bond,
that offers low cost and high throughput solutions for flip
chip assembly. With P-Bond, there is no need for deflux or
additional curing of the underfill material, thereby significantly
reducing cycle time and capital investment as compared to
the conventional underfill process.
No flow underfill is dispensed on the substrate as a first
step. The die is then mounted on the substrate and sent for
reflow attachment. During reflow attachment the no flow underfill
material will cure and form the desired bond and protective
layer between the die surface and substrate.
 |
| P-Bond
(No-Flow Underfill) Product List |
| Product |
EF-72 |
LF-8200 |
LR-9000 |
OP-101 |
| Recommended
Application |
Die
size <5x5mm with Eutectic solder |
Die
size <5x5mm with Leadfree solder |
Die
size <22x22mm with Eutectic and Leadfree solder using
TCB |
Optical
material, for chip-on-glass, Eutectic solder |
| Viscosity
@ 25°C, Kcps |
2.4 |
2.8 |
82 |
2.2 |
| FILLER
Size, average µm |
No
filter |
No
filter |
5 |
No
filter |
| CTE1
(ppm/C) |
70-80 |
75 |
32 |
75 |
| CTE2
(ppm/C) |
200-210 |
200 |
117 |
200 |
| Tg
(C) |
115-130 |
115 |
125 |
125 |
| Flex
Modulus DMA, 1Hz, GPa |
2.6 |
3 |
5.2 |
2.8 |
| Moisture
Absorption 24hr @85°C/85 RH, % |
1.7 |
1.8 |
0.13 |
1.6 |
| Post
Cure (min) |
No |
120@160C |
60@150C |
60@150C |
Contact us for more information now!
|
|
|
